SIG opens tech center in China for new product development

The tech center is located in a 17,500mt2 building, close to the SIG’s packaging plant in Suzhou in China.

The packaging firm said that a team of SIG experts are working at the new facility to develop and manufacture filling technology, conduct filling tests for customers and offer training by focusing on product innovation and differentiation.

SIG CEO Rolf Stangl said: “Asia is a vital market for SIG and our new Tech Center will ensure our customers can realize opportunities much faster, working with our expert team to choose the right product and packaging concept to meet consumer demand and grow their business.

“At our new Tech Center, we can expedite packaging solution development for our customers and carry out test fillings on a weekly basis, to ensure products are launched to market more quickly than ever before. Providing the best technical expertise will deliver end to end solutions in a timely manner required to gain competitive advantage.”